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Y.C. Tsui and T.W. Clyne,
Composites and Coatings Group,
Department of Materials Science and Metallurgy,
University of Cambridge,
Cambridge, U.K.
E-mail
T.W. Clyne: twc10@cus.cam.ac.uk
Released: January 1998.
Added to MAP: September 1999.
This program calculates the through-thickness distribution of (in-plane) stresses resulting from progressive deposition of a coating onto a planar substrate for a specified deposition stress and subsequent temperature change. Also given are the specimen curvature and the strain energy release rate for interfacial debonding.
| Language: | N/A |
| Product form: | Executable files for use on almost any Apple Macintosh or PC. |
Complete Program.
An analytical model has been developed [1] to predict the residual stress distribution in progressively deposited coatings, (such as those produced by thermal spraying). This is based on the concept of a misfit strain, caused by either the deposition stress (e.g. due to quenching of splats in thermal spraying) or by differential thermal contraction between substrates and coating during cooling. The deposition stress is introduced as the coating is formed layer-by-layer, with a specified layer thickness, such that the misfit strain is accommodated after each layer addition (rather than for the coating as a whole).
The program calculates the through-thickness distribution of (in-plane) stresses resulting from progressive deposition of a coating onto a planar substrate for a specified deposition stress and subsequent temperature change. Also given are the specimen curvature and the strain energy release rate for interfacial debonding. The analytical solutions used to carry out the calculations are given in detail in reference 1.
Input data are required in the form of the elastic constants, thermal expansivities and thicknesses of substrate and deposit, deposition ("quenching") stress, the post-deposition temperature change, and the number and thickness of the layers used to model the deposition. These are screen input in response to a series of prompts. The option to use a default set is given at the beginning.
The results are written to 6 different files:
In addition, the strain energy release rate for interfacial debonding after deposition and after the subsequent temperature change are given as screen outputs.
Downloading and running the program
Compiled versions of the programs have been produced as stand-alone applications. They are run simply by double-clicking on the icon concerned. They should run on virtually any Apple Macintosh or PC. Data input is via the screen or by selection of default cases which are offered. Data output is to files which are named by the user. These are produced as files for the plotting application "Kaleidagraph", but they can be read as text files from many other plotting or spreadsheet applications. These output files are normally created within the currently-active folder. The program quits after each complete set of computations. For further use, it is necessary to double-click on the icon again.
The executable files for downloading have been compressed using STUFFIT EXPANDER on the Macintosh and WINZIP or PKUNZIP on the PC. These decoders can be downloaded from the following websites:
STUFFIT EXPANDER at https://www.aladdinsys.com/expander/
WINZIP at https://www.winzip.com/
The run time depends on the number of layers specified (and on machine speed), but even on a relatively slow machine and with the maximum number of layers (100) specified, the program only takes a few seconds to run.
| Gr | - | The strain energy release rate for interfacial debonding after deposition (a) before and (b) after the subsequent temperature change. |
| hd | - | Thickness of the deposited layer (mm). |
| kappa | - | Curvature of the specimen (m-1). |
| z | - | Distance from the interface between the substrate and the deposited layer (mm). |
| sigQ | - | Stress due to deposition (MPa). |
| z | - | Distance from the interface between the substrate and the deposited layer (mm). |
| sigT | - | Stress due to the post-deposition temperature change (MPa). |
| z | - | Distance from the interface between the substrate and the deposited layer (mm). |
| sigNet | - | Net stress (MPa). |
| z | - | Distance from the interface between the substrate and the deposited layer (mm). |
| sigNet Debond | - | Net stress after interfacial debonding (MPa). |
| z | - | Thickness of deposit removed (mm). |
| epsBot | - | Strain registered at the underside of the substrate (millistrain). |
None.
No information supplied.
Further information about this program can be obtained from the Composites and Coating Group website at https://www.msm.cam.ac.uk /mmc/mmc.html and is one of a series of programs produced by Bill Clyne and co-workers in the Materials Science Department at Cambridge.
It should be noted:
Nothing is expected of anyone downloading a program and there is no obligation to use results obtained from it in any particular manner. Equally, there is no liability on the part of the supplier and no guarantee that the programs do not incorporate errors or invalid data. In general, however, the offer is aimed at researchers and is designed to stimulate collaborative work. Anyone downloading a program is therefore invited to give their address to the supplier and is also welcome to enter into contact if they wish to explore any details. In the event that results obtained using any of the programs are published in any form, it would be appreciated if their source could be acknowledged.
Complete program.
Residual Stresses in Thermal Spray Coatings - Planar Analytical Model ¬ YC Tsui & TW Clyne, Cambridge University, 1997 ref: Thin Solid Films, vol.306 (1997) p.23-33 (Unlimited distribution version - please acknowledge when publishing) Stresses arise from quenching of splats & from differential thermal contraction Substrate is free to bend Default case (NiCrAlY (1.04mm) on PK33 (1.65mm))? (Y/N) n Enter substrate Young modulus (GPa) 167 Enter substrate Poisson ratio 0.31 Substrate biaxial modulus (GPa) = 242.029 Enter substrate thickness (mm) 1.62 Enter deposit Young modulus (GPa) 34.1 Enter deposit Poisson ratio 0.31 Deposit biaxial modulus (GPa) = 49.420 Enter deposit thickness (mm) = 1.0 Enter number of incremental layers in deposit (max. = 100) 50 Enter quenching stress (MPa) = 65 Enter post-deposition temperature drop (K) = 400 Enter substrate expansivity at deposition temperature (microstrain/K) = 12.87 Enter substrate expansivity at ambient temperature (microstrain/K) = 12.1 Enter deposit expansivity at deposition temperature (microstrain/K) = 12.41 Enter deposit expansivity at ambient temperature (microstrain/K) = 12.0 Calculating...... Gr before cooling = 84.064 J/m2 Gr after cooling = 74.772 J/m2 Computation complete. Output (principal stresses from deposition & from cooling) stored in 6 files. (Sum these to obtain net stress distribution.) Enter prefix for these 6 files costpl
Below are extracts from the output files.
costpl.kap costpl.stn
hd(mm) kappa(m-1) z(mm) sigNet(MPa)
0.01000000 0.01230517 -1.62000000 102.16314733
0.03000000 0.02477967 0 -151.72803220
0.05000000 0.03741594 0.01000000 28.16332021
0.07000000 0.05020636 0.03000000 28.19630675
... ... ... ...
0.95000000 0.66040999 0.93000000 58.41684603
0.97000000 0.67350847 0.95000000 59.61493324
0.99000000 0.68652041 0.97000000 60.82978772
0.99000000 0.64753794 0.99000000 62.06102778
costpl.stq costpl.std
z(mm) sigQ(MPa) z(mm) sigNetDebond(MPa)
-1.62000000 108.15463538 -1.62000000 0.00000000
0 -161.02106422 0 -0.00000000
0.01000000 31.78156818 0.01000000 5.26998214
0.03000000 31.77602422 0.03000000 4.59871486
... ... ... ...
0.93000000 60.26269080 0.93000000 3.12783208
0.95000000 61.42224751 0.95000000 3.62166546
0.97000000 62.59857148 0.97000000 4.13226612
0.99000000 63.79128104 0.99000000 4.65925235
costpl.stt costpl.ssb
z(mm) sigT(MPa) z(mm) epsBot(millistrain)
-1.62000000 -5.99148805 1.00000000 -0.42211106
0 9.29303202 0.98000000 -0.41599504
0.01000000 -3.61824798 0.96000000 -0.40971560
0.03000000 -3.57971747 0.94000000 -0.40327681
... ... ... ...
0.93000000 -1.84584477 0.06000000 -0.02778311
0.95000000 -1.80731427 0.04000000 -0.01850718
0.97000000 -1.76878376 0.02000000 -0.00924547
0.99000000 -1.73025326 0.00000000 0.00000000
None.
composite, laminate, coating, plane, deposition, temperature change, substrate, strain, stress, temperature, planar
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