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Program MAP_STEEL_INCLUSIONS

  1. Provenance of code.
  2. Purpose of code.
  3. Specification.
  4. Description of program's operation.
  5. References.
  6. Parameter descriptions.
  7. Error indicators.
  8. Accuracy estimate.
  9. Any additional information.
  10. Example of code
  11. Auxiliary routines required.
  12. Keywords.
  13. Download source code.
  14. Links.


Provenance of Source Code

T. Hong and T. DebRoy
Department of Materials Science and Engineering
Pennsylvania State University
University Park, PA 16802
USA

E-mail: rtd1@psu.edu

Added to MAP: March 2000.

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Purpose

The time-temperature-transformation (TTT) diagrams provide a road map to understand the growth and dissolution behavior of inclusions in liquid steels. In particular, the diagrams describe the effects of time and temperature on the growth and dissolution behavior of a particular inclusion in an alloy of known composition. Oxides, nitrides and sulfides are the most common inclusions in steels. This document describes a computer program for the calculation of TTT diagrams for fourteen types of oxide, nitride and sulfide inclusions. The calculations take into account the nucleation rates of inclusions and their subsequent growth or dissolution rates that are calculated considering the diffusion of various species toward or away from the inclusion/liquid alloy interface. Further details about the calculations and a set of computed results are available in reference 1. This document contains a description of the calculation procedure and the computer program used for the calculations. Please see the attached document entitled "ttt.doc".

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Specification

 

The executable will run without any compiler. The program may be recompiled using Digital Visual Fortran. It can also be recompiled with minor modifications in any other Fortran compiler. The product is provided as an executable file and Digital Visual Fortran source codes. The operating system may be Windows 95/98/NT

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Description

The following files accompany this documentation:

ttt.doc: Winword file containing program documentation.

ttt.exe: Executable file. No further compilation is needed.

ttt.f: The main source code to calculate TTT diagrams.

dialogbox.rc: The resource file which contains the dialog boxes, an icon and an image.

resource.h and resource.fd: The header files which define the action of all text boxes, edit boxes and buttons.

icon1.ico and a.bmp: Icon and image files required for compiling the source code.

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References

 

  1. T. Hong and T. DebRoy: Time-Temperature-Transformation Diagrams for the Formation and Dissolution of Oxide, Nitride, and Sulfide Inclusions, unpublished document, Department of Materials Science & Engineering, Penn State, March 2000.
  2. J.W. Christian: The theory of transformations in metals and alloys, p. 535, 2nd edition, 1981, Pergamon Press, Oxford.
  3. M.L. Tuppin and J.F. Elliot: J. Iron Steel. Inst., 1966, Vol. 204, pp. 217-225.
  4. M.J. Whelan: Metal Science Journal, 1969, Vol. 3, No. 5, pp. 95-97.
  5. S.S. Babu, S.A. David, J.M. Vitec, K. Mundra, and T. DebRoy: Materials Science and Technology, Feb. 1995, Vol. 11, No. 2, pp. 186-199.
  6. E.T. Turkdogan: Physical Chemistry of High Temperature Technology, 1980, Academic Press, New York.
  7. G.K. Sigworth and J.F. Elliott: Metal Science Journal, 1974, Vol. 8, No. 9, pp. 298-310.

 

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Parameters

Please see the attached document entitled "ttt.doc".

Input parameters for running with other FORTRAN compilers

Not applicable

Error Indicators

None.

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Accuracy

No information supplied.

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Further Comments

The authors do not guarantee that the program is free of bugs. Please use the code at your own risk. The authors do not have resources to provide free technical support.

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Example

Please see the attached document entitled "ttt.doc".

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Auxiliary Routines

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Keywords

TTT diagram, Inclusion, Oxide, Nitride, Sulfide, Precipitation, Dissolution, Mathematical Modeling

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Download

Download source code (zip file, 0.5 MBytes)

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MAP originated from a joint project of the National Physical Laboratory and the University of Cambridge.

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