| Initial film thickness (h) |
-- |
As-deposited copper coating thickness |
| Annealing duration |
-- |
Total elapsed diffusion time |
| Surface copper concentration (CCu at x = 0) |
-- |
Residual copper at free outer surface (1.00 until depleted) |
| Intrinsic copper diffusivity (DCu) |
-- |
Mobility of copper atoms in the lattice |
| Intrinsic nickel diffusivity (DNi) |
-- |
Mobility of nickel atoms in the lattice |
| Diffusivity ratio (DCu / DNi) |
-- |
Confirms copper outpaces nickel atomic migration |
| Interdiffusion coefficient (D̃) |
-- |
Effective interdiffusivity governing profile broadness |
| Diffusion penetration depth (2√(D̃t)) |
-- |
Characteristic penetration distance into substrate |
| Kirkendall marker displacement (xK - h) |
-- |
Shift of inert interface markers into copper coating |
| Peak vacancy supersaturation (film region) |
-- |
Maximum Cv / Cveq ratio (delamination risk) |
| Peak vacancy subsaturation (substrate region) |
-- |
Minimum Cv / Cveq ratio (lattice contraction zone) |